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3 edition of Proceedings of the 1999 Workshop on Polymeric Materials for Microelectronics and Photonics Applications, Mechanics, Physics, Reliability, Processing, presented at Hotel Concorde Saint-Lazare, December 12-15, 1999, Paris, France found in the catalog.

Proceedings of the 1999 Workshop on Polymeric Materials for Microelectronics and Photonics Applications, Mechanics, Physics, Reliability, Processing, presented at Hotel Concorde Saint-Lazare, December 12-15, 1999, Paris, France

Workshop on Polymeric Materials for Microelectronics and Photonics Applications: Mechanics, Physics, Reliability, Processing (1999 Paris, France)

Proceedings of the 1999 Workshop on Polymeric Materials for Microelectronics and Photonics Applications, Mechanics, Physics, Reliability, Processing, presented at Hotel Concorde Saint-Lazare, December 12-15, 1999, Paris, France

by Workshop on Polymeric Materials for Microelectronics and Photonics Applications: Mechanics, Physics, Reliability, Processing (1999 Paris, France)

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Published by American Society of Mechanical Engineers in New York, N.Y .
Written in English

    Subjects:
  • Polymers -- Congresses.,
  • Microelectronic packaging -- Materials -- Congresses.,
  • Integrated circuits -- Reliability -- Congresses.,
  • Photonics -- Materials -- Congresses.,
  • Polymeric composites -- Congresses.

  • Edition Notes

    Other titles1999 Workshop on Polymeric Materials for Microelectronics and Photonics Applications: Mechanics, Physics, Reliability, Processing, Workshop on Polymeric Materials for Microelectronics and Photonics Applications, Mechanics, Physics, Reliability, Processing, Polymeric Materials for Microelectronics and Photonics Applications, Mechanics, Physics, Reliability, Processing, Poly"99
    Statementsponsored by the Electrical and Electronic Packaging Division, ASME, in cooperation with IEEE Components, Packaging and Manufacturing Technology (CPMT) Society ... [et al.] ; edited by Ephraim Suhir ... [et al.].
    GenreCongresses.
    SeriesEEP ;, vol. 27, EEP (Series) ;, vol. 27.
    ContributionsSuhir, Ephraim., American Society of Mechanical Engineers. Electrical and Electronic Packaging Division., Components, Packaging & Manufacturing Technology Society.
    Classifications
    LC ClassificationsTK7871.15.P6 W68 1999
    The Physical Object
    Paginationviii, 283 p. :
    Number of Pages283
    ID Numbers
    Open LibraryOL6805711M
    ISBN 10079181663X
    LC Control Number00268788
    OCLC/WorldCa43489274


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Proceedings of the 1999 Workshop on Polymeric Materials for Microelectronics and Photonics Applications, Mechanics, Physics, Reliability, Processing, presented at Hotel Concorde Saint-Lazare, December 12-15, 1999, Paris, France by Workshop on Polymeric Materials for Microelectronics and Photonics Applications: Mechanics, Physics, Reliability, Processing (1999 Paris, France) Download PDF EPUB FB2